Publications
International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland, 2023, pp. 1-6. J. Withöft, W. John, E. Ecik und J. Götze, "AI-Based SI-Compliant PCB Design Support for DDR Technology [...] International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland, 2023, pp. 1-6. J. Withöft, W. John, E. Ecik, R. Brüning und J. Götze, “Optimization of a Daisy Chain PCB Memory System [...] International Conference on Omni-layer Intelligent Systems (COINS) , Barcelona, Spain, 2022, pp. 1-6. Svenja Straßburg, Carolin-Maria Linker, Sebastian Brato, Christoph Schöbel, Christian Taube, Jürgen …